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    • 专利摘要:
    An antenna module is described. The antenna module includes a ground plane on a multilayer substrate. The antenna module also includes a non-multilayer mold. The antenna module further includes a conductive wall separating a first mold portion from a second mold portion. The conductive wall is electrically coupled to the ground plane. An insulating shield can be placed on a surface of the second mold portion. The insulating protection is electrically coupled to the ground plane.
    公开号:BR112020006267A2
    申请号:R112020006267-7
    申请日:2018-09-28
    公开日:2020-10-06
    发明作者:Seong Heon JEONG；Neil Burns；Julio Zegarra；Clinton James WILBER；Jordan SZABO；Rajneesh Kumar；Mohammad Ali Tassoudji；Darryl Jessie；Gurkanwal Sahota；Kevin Hsi Huai Wang；Jeong Il Kim；Taesik YANG；Thomas Myers
    申请人:Qualcomm Incorporated；
    IPC主号:
    专利说明:

    [0001] [0001] This application claims the benefit of U.S. Patent Application No. 16 / 145,100, filed on September 27, 2018, and entitled “ANTENNA MODULE CONFIGURATIONS”, which claims benefit from US Provisional Patent Application No. 62 / 566,318, filed on September 30, 2017, and entitled “ANTENNA CONFIGURATIONS” and which claims the benefit of U.S. Provisional Patent Application No. 62 / 688,995, filed on June 22, 2018, and entitled “METHOD AND APPARATUS TO INTEGRATE A MOLD INTO AN ANTENNA PACKAGE ”, whose disclosures are expressly incorporated by reference here in their entirety.
    [0002] [0002] The present disclosure generally relates to wireless communication, and more particularly, to the antenna module configurations. Foundations
    [0003] [0003] Wireless communications can be transmitted over a multitude of different frequencies and bands. For example, communications can be transmitted using a millimeter wave (mmW) signal, for example, somewhere in the range of 24 to 60 gigahertz (GHz) or higher. Such communications are, in some circumstances, transmitted over a large bandwidth. The large bandwidth allows a high volume of information to be transmitted wirelessly. As a result, several applications that specify the transmission of large amounts of data can be developed using wireless communications with wavelengths in the millimeter range.
    [0004] [0004] Facilitating applications in mmW involves the development of circuits and antennas that operate in these frequency bands. The various modules and circuits can be manufactured and packaged in several ways. The size of these circuits may vary.
    [0005] [0005] In the consumer electronics market, the design of electronic devices, including integrated RF components, is generally determined by cost, size and weight, as well as performance specifications. It may be advantageous to further consider the current assembly of electronic devices, and particularly portable devices, to enable efficient transmission and reception of millimeter wave signals. SUMMARY
    [0006] [0006] An antenna module is described. The antenna module includes a ground plane on a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first mold portion from a second mold portion. The conductive wall is electrically coupled to the ground plane. An insulating shield can be placed on a surface of the second portion of the mold. The insulating protection is electrically coupled to the ground plane.
    [0007] [0007] A method of integrating a mold into an antenna module is described. The method includes depositing a mold compound on a multilayer substrate. The multilayer substrate includes a ground plane and a multilayer antenna. The method also includes forming a conductive wall separating a first portion of the mold compound from a second portion of the mold compound. The conductive wall is electrically coupled to the ground plane. The method further includes depositing an insulating protective material on at least one surface of the second portion of the mold compound.
    [0008] [0008] An antenna module is described. The antenna module includes a ground plane on a multilayer substrate. The antenna module also includes a multilayer antenna on the multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes means for suppressing a mold effect with loss of mold on the multilayer antenna on the multilayer substrate.
    [0009] [0009] This described, in general, the resources and technical advantages of the present disclosure, so that the detailed description below can be better understood. Additional features and benefits of disclosure will be described below. It should be appreciated by people skilled in the art that this disclosure can easily be used as a basis for modifying or designing other structures to achieve the same objectives as this disclosure. It should also be realized by those skilled in the art that such equivalent constructions do not deviate from the teachings of disclosure, as set out in the attached claims. The new features, which are believed to be characteristic of the disclosure, as far as their organization and method of operation, together with other objects and advantages, will be better understood from the description below, when considered in connection with the attached figures. It should be expressly understood, however, that each of the figures is provided for purposes of illustration and description only and is not intended to be a definition of the limits of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
    [0010] [0010] So that the way in which the characteristics cited above of the present disclosure can be understood in detail, a more particular description, summarized briefly below, can be obtained by reference to aspects, some of which are illustrated in the attached drawings. It should be noted, however, that the attached drawings illustrate only certain aspects typical of this disclosure and, therefore, should not be considered limiting its scope, as the description may admit other equally effective aspects.
    [0011] [0011] Figure 1 shows a wireless device that communicates with a wireless system, according to an exemplary configuration of the present disclosure.
    [0012] [0012] Figure 2 illustrates a block diagram of the wireless device shown in Figure 1.
    [0013] [0013] Figure 3 illustrates an example of the wireless device described in Figure 1, and includes a description of a configuration for combining information on one line, in accordance with aspects of the present disclosure.
    [0014] [0014] Figure 4 illustrates an example of a wireless device module described in Figures 2 and 3,
    [0015] [0015] Figure 5 illustrates an example of a wireless device module described in Figures 2 and 3, in accordance with aspects of the present disclosure.
    [0016] [0016] Figure 6 illustrates an example of a wireless device module described in Figures 2 and 3, in accordance with aspects of the present disclosure.
    [0017] [0017] Figure 7 illustrates an antenna module having a radiofrequency processing (RF) integrated circuit (IC) and an energy control IC embedded in a mold in the antenna module, having a multi-layer antenna exposed by the mold, accordance with the aspects of this disclosure.
    [0018] [0018] Figures 8A and 8B illustrate a perspective view and a cross-sectional view of an antenna module, with chips embedded in a mold in the antenna module and a multilayer antenna having a portion exposed by the mold, according to aspects of this disclosure.
    [0019] [0019] Figure 9 illustrates a portion of the wireless device described in Figure 1, incorporating a module, in accordance with aspects of the present disclosure.
    [0020] [0020] Figure 10 illustrates an example of the wireless device described in Figure 1, incorporating several antenna modules along a periphery of the wireless device, in accordance with aspects of the present disclosure.
    [0021] [0021] Figures 11A and 11B further illustrate examples of the wireless device of Figure 10, in accordance with aspects of the present disclosure.
    [0022] [0022] Figures 12A and 12B further illustrate examples of the wireless device of Figure 10, in accordance with aspects of the present disclosure.
    [0023] [0023] Figures 13A and 13B further illustrate a portion of the wireless device described in Figure 1, in accordance with aspects of the present disclosure.
    [0024] [0024] Figure 14 illustrates an example of an apparatus that can be implemented with the devices illustrated in Figures 13A and 13B instead of using an interposer configuration, according to the aspects of the present disclosure.
    [0025] [0025] Figure 15 is a flow chart that illustrates a method of integrating a mold into an antenna module, according to an aspect of the present disclosure. DETAILED DESCRIPTION
    [0026] [0026] The detailed description set out below, in connection with the accompanying drawings, is intended to be a description of various configurations and is not intended to represent the only configurations in which the concepts described here can be practiced. The detailed description includes specific details in order to provide a complete understanding of the various concepts. It will be evident, however, to people skilled in the art that these concepts can be practiced without these specific details. In some cases, known structures and components are shown in block diagram format, in order to avoid obscuring such concepts.
    [0027] [0027] As described in this document, the use of the term "and / or" is intended to represent an "inclusive OR", and the use of the term "or" is intended to represent an "exclusive OR". As described herein, the term "exemplary" used throughout this description means "to serve as an example, instance or illustration" and should not necessarily be interpreted as preferable or advantageous over other exemplary configurations. As described herein, the term “coupled” used throughout this description means “connected, directly or indirectly, through intermediate connections (for example, a switch), electrical, mechanical or otherwise”, and is not necessarily limited to physical connections. In addition, the connections can be such that the objects are permanently connected or releasably connected. Connections can be via switches. As described herein, the term "near" used throughout this description means "adjacent, very close, near or near". As described here, the term “activated” used throughout this description means “directly activated” in some configurations and “indirectly activated” in other configurations.
    [0028] [0028] Wireless communication devices, which may include one or more transmitters and / or receivers, have one or more antennas capable of transmitting and receiving RF signals over a variety of wireless networks and associated bandwidths. These antennas can be used for fifth generation (5G) millimeter wave (mmW) communications, WLAN communications (for example,
    [0029] [0029] Projects for such millimeter wave antennas (mmW) and integrated circuits (eg, radio frequency integrated circuits (RFICs), power management integrated circuits (PMICs), etc.) are desired. According to some modalities, there may be a desire to integrate these antennas and ICs into a chip package. This integration may involve depositing a mold in RFIC, PMIC and other circuits to implement insulating protection and packaging reliability. Notably, the characteristics of epoxy based molding compounds can result in significant loss in high frequency applications, such as in 5G mmW applications, which is referred to here as a lossy mold effect.
    [0030] [0030] Solutions to reduce loss in high frequency applications include reducing the amount of mold or avoiding the deposit of a mold directly on the antenna element (s). These solutions, however, can reduce protection and reliability in the packaging.
    [0031] [0031] Aspects of the present disclosure are directed towards improvements in antenna systems, for example, mmW antenna systems, fifth generation antenna systems (5G) (“5G antenna systems”), and / or antenna systems WLAN Certain aspects described here refer to a design and method of integrating a mold with a multilayer millimeter wave (mmW) antenna, a radio frequency integrated circuit (RF) (RFIC), and other circuits.
    [0032] [0032] In one aspect of the present disclosure, a conductive wall separates two portions of a mold. As described here, a first mold portion is termed here as a non-metallized mold, and a second mold portion is termed here as a metallized mold due to the cover of the metallized mold with a material protection. It should be recognized that although named as metallized or non-metallized, the mold is otherwise formed from the same material (for example, epoxy, polyimide or other similar mold material). The mold can be deposited on a multilayer substrate, including a multilayer antenna. In this configuration, the conductive wall separates the non-metallized mold (unprotected mold) which does not include an insulating protection from the metallized mold (protected mold) that encapsulates integrated circuits. The conductive wall can be formed by filling a conductive paste or by spraying conductive particles. Alternatively, the conductive wall can be composed of a solid conductive sheet or a frame. Forming the conductive wall suppresses a mold effect with loss in antennas caused by the conventional epoxy mold. Therefore, the system performance of the antenna module is not significantly degraded.
    [0033] [0033] In various configurations, the conductive wall can be connected to a ground plane on the multilayer substrate. The conductive wall can act as a reflector preventing the metallic mold from adversely affecting the antenna element, in which the wall is displaced from the antenna element by approximately 1/4 1/4 wavelength. The conductive wall can be formed on the other sides of the mold as desired (for example, right, left, rear, and / or top). In addition, the conductive wall can be configured as a series of connected pathways to allow the electrical connection of the conductive wall to the ground plane on the multilayer substrate.
    [0034] [0034] Figure 1 illustrates a wireless device 110 that communicates with a wireless communications system 100, having an antenna module integrated into a mold. The wireless communications system 100 can be a fifth generation (5G) millimeter wave (mmW) system, a long term evolution (LTE) system, a code division multiple access system (CDMA), a system global for mobile communications system (GSM), a wireless local area network (WLAN) system or some other wireless system. A CDMA system can implement broadband CDMA (WCDMA), CDMA IX, optimized evolutionary data (EVDO), time division synchronous CDMA (TD-SCDMA) or some other version of CDMA. For simplicity, Figure 1 shows the wireless communications system 100, including two base stations 120 and 122 and a system controller 130. In general, a wireless system can include any number of base stations and any set of network entities . In some embodiments, one or more of the base stations are implemented as access points, for example, as can be implemented in a WiFi system. The wireless device 110 can communicate at separate times with two or more of the systems listed above, or it can communicate simultaneously with several systems.
    [0035] [0035] Wireless device 110 can also be referred to as user equipment (UE), a mobile station, a mobile device, a terminal, an access terminal, a subscriber unit, a station, etc. The wireless device 110 can be a cell phone, smartphone, tablet, wireless modem, personal digital assistant (PDA), portable device, laptop computer, smartbook, netbook, cordless phone, wireless local loop station (WLL) , Bluetooth device, a medical device, a device that communicates with the Internet of Things (IoT), etc. Wireless device 110 can communicate with the wireless communications system
    [0036] [0036] Figure 2 illustrates an example 110a of wireless device 110 described in Figure 1. Wireless device 110a includes baseband processing and / or transceiver elements 210 coupled to a connector 220. Transceiver elements 210 can include a baseband chip configured to process data and provide digital signals to a transceiver chip configured to convert digital signals into analog intermediate frequency (SE) signals. The baseband chip and / or the transceiver chip of the elements of transceiver 210 can supply both SE signals to connector 220 to transmit and control signals to connector 220. In addition, elements of transceiver 210 may receive SE signals. through connector 220 and can additionally convert those signals down and provide digital signals corresponding to the baseband chip for processing. The elements of transceiver 210 can also supply a local oscillator (LO) signal (not shown) to connector 220. The LO signal can be separated from or combined with the SE signal, for example, as described in more detail below.
    [0037] [0037] In the configuration illustrated in Figure 2, the wireless device 110a still includes a power source 224 coupled to connector 220. Power source 224 can by any configured element provide power or a supply voltage (for example, Vdd) . For example, power source 224 can be a battery, an input coupled to a power input such as a USB input or a wireless charging input, a power management integrated circuit (PMIC), or a combination of these elements or other elements.
    [0038] [0038] The elements of transceiver 210 including the baseband chip and / or the transceiver chip, connector 220, and / or power source 224 can be arranged on a board 201 (for example, a circuit board and / or telephone card). For example, chips, arrays, and / or modules that implement these elements can be coupled together with dashes on a printed circuit board (PCB).
    [0039] [0039] The wireless device 110a can further include RF processing elements (for example, an RF chip 230) coupled to a connector 240. The RF circuitry can perform upward conversion of signals based on SE and control signals from connector 240 and downward conversion of received signals. The RF processing elements of the RF chip 230 can be coupled to antennas 231 and 232 for transmitting and receiving wireless signals. Although two antennas are illustrated in Figure 2, those skilled in the art will understand that additional or less antennas can be implemented. In one aspect of the present disclosure, one or more of the implemented antennas includes a phase array antenna. The wireless device 110a can allow efficient transmission and reception of signals having a millimeter wavelength, for example in at least the range of 24 to 40 GHz, (for example, 28 GHz, 39 GHz, etc.), range of 60 GHz or higher.
    [0040] [0040] In the configuration illustrated in Figure 2, the wireless device 110a still includes a power control integrated circuit (IC) 244 (for example, a power management IC (PMIC)). The power control IC 244 receives the supply voltage from connector 240 and is configured to convert the supply voltage into several different voltages for use by the components of the RF processing elements of the RF chip 230.
    [0041] [0041] The RF processing elements of the RF chip 230, the connector 240, the power control IC 244, and / or the antennas 231, 232 can be arranged on a circuit board or substrate or integrated into a module
    [0042] [0042] The elements of the transceiver 210 and the RF processing elements of the RF chip 230 can be spaced apart and connected using a communications cable 250 (or several transmission lines), for example, through connector 220 and of connector 240. In one aspect of the present disclosure, elements of transceiver 210 and RF processing elements of RF chip 230 are respectively located near a central portion of wireless device 110a and near the periphery of wireless device 110a . Placing the elements of the transceiver 210 and the RF processing elements of the RF chip 230 away from each other can allow efficient information processing while achieving increased performance for receiving / transmitting wireless signals. Such placement may not be in proximity.
    [0043] [0043] One or more signals can be transferred via communications cable 250 including, but not limited to, power, control, SE, and LO signals. The SE and control signals can be transferred via communications cable 250 in both directions, so that communications cable 250 is bidirectional. The control signals can control the switching of the antennas (for example, between TX and RX), the direction of the antenna (for example, beam conformation), and gain. LO signals can be used to synchronize components in the elements of transceiver 210 and the RF processing elements of the RF chip 230, and / or perform up and down conversions of high frequency signals.
    [0044] [0044] In some configurations, each signal is transferred on a separate line from the communications cable 250. For example, a coaxial cable can carry each signal between board 201 and module 202. In other configurations, the communications cable 250 includes several lines for transferring signals. For example, communications cable 250 can be a flexible cable or flexible circuit board including several lines. In yet another configuration, two or more of the signals can be combined on a single line or cable. For example, each signal transferred via communications cable 250 may have a different frequency band.
    [0045] [0045] In certain aspects of the present disclosure, a frequency plan allows the efficient transfer of two or more (or all) signals through the communications cable 250. According to certain aspects of this disclosure, the communications cable 250 is a standard micro coaxial cable. In this configuration, the connection between board 201, module 202, and the micro coaxial cable is provided using a micro connector. According to another aspect, the communications cable 250 can be formed by making a metal line in a multilayer substructure.
    [0046] [0046] When several signals are simultaneously transmitted via communications cable 250, the signals can be multiplexed on communications cable 250 or one of the signals can be modulated on the other. The elements of transceiver 210 may include circuits configured for such multiplexing or modulation. In particular, the RF chip 230 transceiver elements may include circuitry for demultiplexing or corresponding demodulation. An example of such a transport is described below in relation to Figure 3.
    [0047] [0047] In some configurations, power control IC 244 is omitted from module 202. In such configurations, separate voltages can be received from a component on board 201 (for example, from a PMIC), via the cable of communications 250 or through another transport. For example, a PMIC can be implemented on board 201 at a location closer to module 202 than to elements of transceiver 210. In this configuration, supply separate specified voltage levels to module 202 instead of implementing power control IC 244 in module 202 can reduce the length of routing lines and / or prevent the use of certain components in module 202, such as inductors used to implement power control IC 244. In some configurations, the transmission of separate voltages to module 202 results in reduced efficiency due to the routing of the various voltages, but it also results in reduced size, costs, and complexity of module 202.
    [0048] [0048] Figure 3 illustrates an example 110b of the wireless device 110 described in Figure 1, and includes a description of a configuration for combining information on one line, in accordance with aspects of the present disclosure. Wireless device 110b includes card 201 attached to module 202 by a communications cable 250, as shown in Figure 2. In the configuration shown in Figure 3, an SE 310 chip is arranged on card 201 and is configured to provide two signals of SE, a LO signal and a control signal, to module 202 via communications cable 250.
    [0049] [0049] As described above in relation to Figure 2, one or more of these signals can be transmitted in both directions (for example, not only from plate 201 to module 202, but also from module 202 to plate 201). Although not shown in Figure 3, the elements described as being on plate 201 in Figure 2 can also be implemented in wireless device 110b. For example, connector 220 can be implemented between the SE 310 chip and the communications cable 250, or it can be omitted as shown in Figure 3.
    [0050] [0050] In accordance with aspects of this disclosure, omitting connector 220 may be beneficial in some configurations where communications cable 250 is routed to another section of board 201 instead of to a separate board, for example, as described in more detail below. In addition, the SE 310 chip can be implemented within the elements of transceiver 210 illustrated in Figure 2, or it can be implemented separately. Likewise, power source 224 can be implemented or omitted, and can transmit the supply voltage through communications cable 250 in some configurations of wireless device 110b.
    [0051] [0051] In the configuration illustrated in Figure 3, an RF chip 320 is disposed in module 202 and is configured to receive the two SE signals, the LO signal and the control signal, through communication cable lines 250. The RF chip 320 can be configured to convert the SE signals down to RF signals using the LO signal and / or the control signal and wirelessly transmit RF signals, for example, based on the control signals. Transmission can be through one or more antennas (not shown in Figure 3), such as antennas 231 and 232 illustrated in Figure 2.
    [0052] [0052] The RF 320 chip can also be configured to receive RF signals wirelessly, convert them down to SE signals, and transmit them over the lines of communications cable 250 to the SE 310 chip. not shown in Figure 3, the elements described as being arranged on plate 201 or module 202 in Figure 2 can also be implemented in wireless device 110b. For example, connector 240 can be implemented between RF chip 320 and lines of communications cable 250, or it can be omitted as shown in Figure 3. Likewise, power control IC 244 can be included in some settings. The RF chip 320 can be implemented within the RF processing elements of the RF chip 230 illustrated in Figure 2, or it can be implemented separately.
    [0053] [0053] In the configuration illustrated in Figure 3, an SE signal is transmitted on each of the lines of the communications cable 250 and another signal is combined with the respective SE signal on the respective line of the communications cable 250. For example, a first SE signal (IF1) can be combined with a control signal (CTRL) for communications over a communications cable line
    [0054] [0054] In this example, the SE signals (for example, SE1 and IF2) can have a frequency in the range of approximately 6.9 to 10.23 GHz. An LO signal having a frequency in the range of approximately 370 to 630 MHz can therefore be combined with one of the second IF IF2 signals. Likewise, a CTRL signal also having a frequency in the range of approximately 370 to 630 MHz can be combined with the first IF IF1 signal. In this way, the number of communication lines of the communication cable 250 specified to transmit all signals can be reduced. Certain frequencies are provided above as an example, but modalities are not limited to those frequencies. One or more of the CTRL signal, LO signal, SE1 signal, and IF2 signal may have a different frequency than that described above. For example, the signal of SE1 and / or the signal of IF2 can have a frequency of approximately 11 GHz or higher. In some embodiments, the IF1 signal and the IF2 signal have different frequencies.
    [0055] [0055] Before being transmitted through cable 250, the signals from IF1 and IF2 and the LO signal and / or the CTRL signal can be passed through a high pass filter (HPF), a low pass filter (LPF) , and / or a bandpass filter (GMP) to reduce any potential interference with another signal that will be transmitted on the same communication line. At the receiving end, the combined signal can be passed through an HPF, an LPF, and / or a BPF to isolate and / or separate the different components of the combined signal.
    [0056] [0056] Figure 4 illustrates an example 202a of module 202 of wireless device 110 described in Figures 2 and 3, in accordance with aspects of the present disclosure. In the illustrated configuration, module 202a includes a connector 240a, which is illustrated as an eight-pin connector. The connector 240a can be configured to attach to a flexible cable 250a. In such a configuration, there may be several lines for intermediate frequency (SE) signals (for example, two or more), one line for a power supply (for example, Vbatt or VDD), a local oscillator signal (LO) , and a control signal (CTRL), with the remaining lines being dedicated to grounding.
    [0057] [0057] In some configurations, the SE signals, an LO signal and / or a control signal (CTRL) are modulated on the same line, as described above in relation to Figure 3. For example, a configuration of module 202a can include a first intermediate frequency signal (SE1) and a control signal (CTRL) on one line, a second SE signal (IF2) and a LO signal on another line. The configuration also includes a grounding line associated with each of the SE1 and IF2 lines, a Vbatt line, a line for a voltage of approximately 1.85 V, and two additional grounding lines. Those skilled in the art will understand that a flexible cable 250a having fewer lines and a connector 240a having fewer pins can be implemented. In some configurations where fewer lines are used, a signal line can be used as a ground or it can be a row of tracks in a flexible connector used for flexible cable 250a.
    [0058] [0058] The illustrated configuration of module 202a still includes a set of filter capacitors 402 coupled to a power control IC 244a (for example, a power management IC (PMIC)). The energy control IC 244a is further coupled to the regulating elements 404 that can be used to control voltage decrease and / or increase. For example, capacitors 406 can be coupled to regulatory elements 404 and included as dimming capacitors for storing and releasing energy. The power control IC 244a, RFIC 230a, regulatory elements 404, and capacitors 406 can be enclosed within a shield 412 or mold, as described further below. Capacitors 406 can also be coupled to several bypass capacitors 408, which can be coupled to the RF processing elements of an RF integrated circuit (RFIC) (for example, RFIC 230a), for example, as described in relation to the chip RF 320 shown in Figure 3. The RF processing elements of the RFIC 230a can also be coupled to certain pins of connector 240a, for example, SE pins, LO pins, and control pins.
    [0059] [0059] The RFIC 230a can also be coupled to one or more antennas (for example, antennas 231a and / or 232a). In the illustrated configuration, antennas 232a (e.g., dipole or bowtie) are illustrated. In one configuration, each of the antennas 232a is aligned with a respective antenna 231a, which is implemented in a lower layer and is not visible in Figure 4. For example, one of the antenna 231a may comprise a set of 4x1 patch antennas configured for transmission and reception using millimeter wave signals. In other configurations, a greater or lesser number of antennas may be used.
    [0060] [0060] In one configuration, module 202a is approximately 21 mm (millimeters) long, 6.6 to 6.65 mm wide, and 1.78 to 1.8 mm thick. Other sizes or formats can also be implemented.
    [0061] [0061] A person skilled in the art will evaluate that the coupling elements described above in relation to module 202a can be implemented in a layer below what is illustrated in Figure 4 and may not be visible in the figure. For example, there may be five conductive routing layers (for example, metal) that are not visible. In addition to these routing layers, a layer of ground, which can be separated from the metal layers that implement antenna 231a (for example, remote antenna), is obscured by a dielectric core. In some configurations, each patch antenna is approximately 2.4 mm square and can consist of three or four conductive layers (for example, metal) in combination with two or three additional layers for routing and / or grounding. In this way, there can be a symmetrical number of layers on each side of the dielectric.
    [0062] [0062] A person skilled in the art will appreciate that although a number of capacitors or other elements are illustrated in Figure 4, different numbers of these capacitors or elements can be implemented. In addition, other shapes, sizes, components and configurations can be used. For example, other potential configurations are illustrated in Figures 5 and 6.
    [0063] [0063] Figure 5 illustrates an example 202b of module 202 of wireless device 110 described in Figures 2 and 3, in accordance with aspects of the present disclosure. As can be seen in Figure 5, module 202b includes connector 240a, antennas 232a, RFIC 230a, regulatory elements 404, capacitors 406, power control IC 244a, and optionally antenna 231a. Module 202b may also include other elements, which are illustrated in Figure 5 and similar to those described in Figure 4, but not specifically identified.
    [0064] [0064] A difference between module 202a in Figure 4 and module 202b in Figure 5 is that the implemented elements are arranged in a different configuration. For example, in the example shown in Figure 5, RFIC 230a is placed closer to connector 240a than in Figure
    [0065] [0065] Another difference between module 202a in Figure 4 and module 202b in Figure 5 is that a protection 510 extends both in RFIC 230a and in the power control IC 244a. The 510 protection can be configured, for example, as a “tin” metal protection. In some configurations, the power control IC 244a can be separated from the RFIC 230a by a (for example, metal) wall or barrier within the protection 510. In some configurations, a separate protection is formed around the control IC of power 244a inside protection 10. Module 202b can be sized similarly to module 202a in some configurations. In other configurations, the 510 guard results in an increase in thickness, for example, of about 2.15 mm.
    [0066] [0066] Figure 6 illustrates an example 202c of module 202 of wireless device 110 described in Figures 2 and 3, in accordance with aspects of the present disclosure. As can be seen in Figure 6, module 202c includes regulatory elements 404, capacitors 406, power control IC 244a, and antenna 231a. Module 202c can also include other elements that are illustrated in
    [0067] [0067] Module 202c is illustrated in Figure 6 as including a six-pin connector as the pin connector 240b. In some configurations, one or more of the grounding lines can be omitted as compared to the configurations of the flexible cable 250a described above in relation to Figure 4. In some configurations, one of the voltages (for example, 1.85 V) carried by the flexible cable 250a is omitted. In this aspect of the present disclosure, module 202c is illustrated as omitting antennas 232a. In some configurations, omitting the antennas 232a and / or using the pin connector 240b with fewer pins may result in a reduced width of module 202c in relation to module 202b of Figure 5.
    [0068] [0068] In the configuration illustrated in Figure 6, the RF processing elements of an RFIC 230b are configured in a different format as compared to the RFIC 230a shown in Figure 5. For example, the RFIC 230b can be approximately 7 mm long and 3.5 mm wide. This can be a contributing factor in reducing the size of module 202c.
    [0069] [0069] Module 202c may also include a 610 protection that covers both IC and RFIC 230b and power control IC 244a. In some configurations, module 202c is implemented using an insulating mold with a spray protection. These aspects, as well as the aspects described above, can result in a reduced size of the 202c module. For example, in one configuration, module 202c is approximately 20 mm long, 4 mm wide, and 1.8 mm thick.
    [0070] [0070] Aspects of the present disclosure integrate an antenna module (eg 202) incorporating an RFIC (eg 230), a PMIC (eg 244), and an antenna array (eg 232) to support millimeter wave of 5G communications (mmW) and / or WLAN applications. As will be described below, this integration may involve depositing a mold in RFIC, PMIC, and another set of circuits to implement insulating protection and packaging reliability, as shown in Figure 6. Unfortunately, the characteristics of mold compounds can result in loss significant in high frequency applications such as 5G mmW and / or WLAN applications.
    [0071] [0071] Solutions to reduce loss in high frequency applications may include reducing the amount of mold or avoiding the deposit of a mold directly on the antenna element (s). These solutions, however, can reduce protection and reliability in the packaging. Aspects of the present disclosure refer to a design and method of integrating a mold with a multilayer millimeter wave (mmW) antenna, a radio frequency integrated circuit (RF) (RFIC), and, optionally, an energy management IC ( PMIC), for example, as shown in Figure 7.
    [0072] [0072] Figure 7 illustrates an antenna module 700 having an RF processing IC and an energy control IC embedded in a mold in the antenna module 700, and having a multilayer antenna exposed by the mold, according to the aspects of this disclosure. The antenna module
    [0073] [0073] In this configuration, the conductive wall 720 is connected to a ground plane 702 on the multilayer substrate 710, as well as to an insulating protection 760. The conductive wall 720 can act as a reflector preventing the metallic mold 732 from damaging a antenna element (e.g. dipole antenna 712), wherein the conductive wall 720 is displaced from the antenna element by approximately 1/4 1/4 wavelength. The conductive wall 720 can be formed on the other sides of the metallized mold 732 as desired (for example, right, left, rear, and / or upper). In addition, the conductive wall 720 can be configured as a series of connected pathways to allow the electrical connection of the conductive wall 720 to the ground plane 702 on the multilayer substrate
    [0074] [0074] Figure 7 shows the insulating protection 760 covering the metallized mold 732 as well as the conductive wall 720 to protect the RFIC 740 and the PMIC 750. The insulating protection 760 can be composed of a conductive material, such as a pulverized conductive material (for example, copper) on the surface portion of the metallized mold 732, a side wall of the metallized mold 732, and a side wall of the multilayer substrate 710. In this arrangement, the insulating protection is also electrically coupled to the ground plane. The non-metallized mold 730, however, does not include insulating protection 760 to prevent protection from, for example, the dipole antenna 712. The multilayer substrate 710 may include a multilayer antenna composed of a patch antenna 714 coupled in a communicable way to the dipole antenna. 712. In this configuration, the ground plane 702 on the multilayer substrate 710 stops at the conductive wall 720 and is arranged to reduce the blocking of a radiation pattern from the dipole antenna 712. Although a single dipole antenna (for example, 712) and patch antenna ( for example, 714) are shown, a person skilled in the art will evaluate that a multi-layer antenna array, including dipole antenna 712 and patch antenna 714 can be implemented.
    [0075] [0075] Figure 7 shows the conductive wall 720 formed on one side of the non-metallized mold 730 which is deposited on the multilayer substrate 710. In this configuration, the conductive wall 720 separates the non-metallized mold 730 (unprotected mold) which does not include the insulating protection 760 from the metalized mold 732
    [0076] [0076] Figures 8A and 8B illustrate a perspective view and a cross-sectional view of an antenna module 800, with chips embedded in a mold in the antenna module 800 and a multilayer antenna having a portion exposed by the mold, according with the aspects of this disclosure. Antenna module 800 can be a configuration of module 202, and can include a connector (not shown in Figures 8A and 8B) configured to attach to a cable 250.
    [0077] [0077] Figure 8A illustrates the perspective view of the antenna module 800, in which chips embedded in a metalized mold 832 are obscured by an insulating protection 850, in accordance with the aspects of the present disclosure. In this arrangement, the antenna module 800 is configured in the same way for the antenna module 700 shown in Figure 7. The antenna module 800 is shown to include a set of dipole antennas 812 printed in layers of a multilayer substrate 810 supported by a 802 ground plane, as further illustrated in Figure 8B. The insulating protection 850 in the metallized mold 832 is separated from a non-metallised mold 830 by a conductive wall 820 as well as a ditch (not identified in Figure 8A). In this example, the trench can be formed by engraving between the metallized mold 832 and the conductive wall 820. Certain dipole antennas 812 and / or patch antennas may not be covered by a non-metallised mold 830 and / or by the metallized mold 832. For example, in the illustrated embodiment, the multilayer substrate 810 also includes a moldless portion. In one configuration, a ditch is formed between the conductive wall 820 and the metallized mold 832, as further illustrated in Figure 8B.
    [0078] [0078] Figure 8B is a cross-sectional view of the antenna module 800 along a Y-Y axis ”shown in Figure 8A, according to the aspects of the present disclosure. Representatively, one of the dipole antennas 812 is shown on the multilayer substrate 810, and supported by the ground plane 802 and the conductive wall. In this configuration, the portion of the multilayer substrate 810 including the dipole antennas 812 is covered by the non-metallized mold 830 and does not include the ground plane 802 to prevent the degradation of a radiation pattern from the dipole antennas
    [0079] [0079] According to the aspects of the present disclosure, the conductive wall 820 as well as the ditch 860 are on one side of the metallized mold 832 to suppress the effects of a lossy mold to cause significant performance degradation (for example, gain of 1.9 dB realized at 38.5 GHz) of the antenna module 800. In one configuration, the conductive wall 820 is connected to the ground plane 802. This arrangement allows the conductive wall 820 to act as a reflector maintaining the mold (for example, example, the non-metallized mold 830 and the metallized mold 832) to affect the dipole antennas 812. For example, the conductive wall 820 can be displaced from the dipole antenna by approximately a 1/4 wavelength to reflect a radiation pattern dipole antennas. Although shown on one side of the metallized mold 832, the conductive wall 820 and the ditch 860 can be arranged on other sides of the metallized mold 832 (for example, right side, left side, rear side, and / or upper side) to allow for placing the additional dipole antennas on the periphery of the antenna module 800. The conductive wall 820 can be formed by filling in a conductive paste (for example, copper (Cu)) or by spraying conductive particles (for example, Cu). In addition, the conductive wall 820 can be manufactured using a series of paths connected through the metallized mold.
    [0080] [0080] Figure 9 illustrates an example 900 of a portion of the wireless device 110 described in Figure 1, incorporating a module, in accordance with aspects of the present disclosure. A section of an enclosure 910 of device 900 is visible in Figure 9. This section may stop as illustrated, for example, when a different part (not shown) of the case (for example, of a different material) is attached to it. In other examples, housing 910 can be interpreted in Figure 9 as being sharp for ease of viewing, but it can extend all the way through module 202 when assembled.
    [0081] [0081] In Figure 9, the base band and / or elements of transceiver 210 are visible as being mounted on plate 201. The elements of transceiver 210 and plate 201 can be approximately parallel with a screen (not shown) of device 900 and / or a support (not shown) of the 900 device.
    [0082] [0082] As can be seen in Figure 9, the elements of the transceiver 210 and / or the board 201 can be coupled to module 202 by the communications cable 250. In the embodiment illustrated in Figure 9, the communications cable is implemented as a cable flexible 250b. For example, flexible cable 250b may include six or eight lines as described above. It can be seen that module 202 is mounted so that it is at an angle to the plate
    [0083] [0083] Module 202 can be coupled to flexible cable 250b through connector 240. In addition, in Figure 9, antennas 231 (for example, patch antennas) and antennas 232 are still illustrated. It will be understood by those skilled in the art that other elements of module 202 are implemented in Figure 9, but are not shown for ease of explanation. In contrast, antennas 231 and 232 are illustrated in order to describe certain aspects of the configuration example.
    [0084] [0084] In the configuration illustrated in Figure 9, they are positioned to radiate and / or receive through one side, including the display and / or the support of the 900 device. In some configurations, this provides diversity and / or increases the probability successful transmission and / or reception when one or more antennas 231 are blocked. Thus, antennas 231 and antennas 232 can radiate and / or receive over an azimuth greater than 180 °.
    [0085] [0085] Figure 10 illustrates an example wireless device 1000 of wireless device 110 described in Figure 1, incorporating several antenna modules along a periphery of wireless device 1000, in accordance with aspects of the present disclosure. A housing 1010 as well as internal portions of the wireless device 1000 are visible in Figure 10. In this example, each antenna module 800 uses flexible cable 250b to secure the antenna module 800 to a point along a periphery of housing 1010 of the wireless device 1000. This configuration fits into each antenna module 800 within the housing with minimal impact on the space on the circuit board, antennas, speakers, cameras and the like. This configuration can be beneficial for fifth generation (5G) and / or millimeter (mmW) WLAN communications, which are more directional than the lower frequencies (for example, 4G bands <3 GHz).
    [0086] [0086] Figures 11A and 11B further illustrate examples of the wireless device 1000 of Figure 10, in accordance with aspects of the present disclosure. In these examples, antenna module 800 is placed in a central region of card 201 of wireless device 1000 (Figure 11A) and / or on an edge of card 201 of wireless device 1000 (Figure 11B) using a direct connection 1102 to the board 201 (for example, a board-to-board connector). Representatively, Figures 11A and 11B illustrate options for placing the antenna module 800 in various locations, which is important for better radioactive coverage. This placement of each antenna module 800 can improve radioactive energy, as measured by a cumulative distribution function (CDF). Although the antenna module 800 is shown using a plate-to-plate connector, those skilled in the art will recognize that the antenna module 800 can be attached to the plate 201 using a sphere grid array (BGA) connection including input / output (IO) and ground connections. Although illustrated in Figure 11A as including dipole antennas, antenna module 800 may omit dipole antennas.
    [0087] [0087] Figures 12A and 12B further illustrate examples of the wireless device 1000 of Figure 10, in accordance with aspects of the present disclosure. In these examples, antenna module 800 is placed on the edge of card 201 of wireless device 1000 using a direct connection 1202 to card 201 (for example, a card-to-card connector). Although the antenna module 800 is shown using a plate-to-plate connector, those skilled in the art will recognize that the antenna module 800 can be attached to the plate 201 using a sphere grid array (BGA) connection including input / output (IO) and ground connections. In this aspect of the present disclosure, antennas 1212 (eg dipole antennas 812 and / or patch antennas 714) are flexible connected to antenna module 1200 (eg 800) to provide even more flexibility to improve radiation from the antenna 1212 For example, when the antenna module 1200 is tilted in relation to plate 201, antenna 1212 can be angled to radiate and / or receive from different directions. For example, when antenna module 1200 is mounted approximately perpendicular to card 201 (and therefore approximately perpendicular to a screen (not shown) and / or bracket (not shown) of the wireless device 1000), the patch antennas ( for example, 1212) can radiate and / or receive energy from a direction that is approximately perpendicular to such a screen and / or support.
    [0088] [0088] In one configuration, antenna 1212 can be configured to beam and / or receive from the side of the wireless device 1000, or from the top or bottom of the wireless device 1000. This can improve reception or transmission in certain circumstances, for example when a portion of a user's hand is covering all or part of the support or screen. For example, receiving from a direction approximately perpendicular to one side or the top of a wireless device can improve reception when the user's hand is holding the bottom of the wireless device and / or when the user's face is against or near the screen of the wireless device.
    [0089] [0089] In some configurations, the antenna and / or the RF elements can be implemented on the same board (for example, board 201) as the baseband chip and / or transceiver chip of the elements of transceiver 210 (and / or RFIC 740). They can continue to be coupled together by the communications cable 250, but connectors can be omitted in some such configurations because a separate module including antennas and / or RF elements is not implemented.
    [0090] [0090] Figure 13A illustrates an example 110d of a portion of the wireless device 110 described in Figure 1, in accordance with aspects of the present disclosure. In Figure 13A, an RFIC 230c is mounted on plate 201 using an interposer and a mold (which can, for example, be non-metallized mold 830 and / or metallized mold 832 and can touch the conductive wall 820). As can be seen in Figure 13A, several antennas can be embedded in the board 201 as well. These antennas can include dipole antennas, as illustrated, and / or patch antennas (not visible). For example, patch antennas can be designed on board 201 or on a specific module separate from the patch antennas to which the interposer is attached. The interposer can be attached to the separate patch antenna module, with both modules attached to the 201 board.
    [0091] [0091] In some configurations, there is a set of 2x2 patch antennas. It can be two dipole antennas that extend adjacent the two respective patch antennas, as illustrated, or it can be four dipole antennas that extend from three of the patch antennas. For example, in addition to the two dipole antennas illustrated in Figures 8A and 8B, there may be two additional dipole antennas that extend from an adjacent side, so that two dipole antennas are coupled next to a patch in the corner, and one dipole antenna is coupled next to each respective patch laterally spaced. Match and / or route antenna impedance can be included within the interposer.
    [0092] [0092] Figure 13B illustrates an example 110e of a portion of the wireless device 110 described in Figure 1, in accordance with aspects of the present disclosure. In Figure 13B, the interposer and dipole antennas hover over the edge of the plate 201. In the configurations in Figure 13B, the dipole antennas can extend into a side or top or bottom portion of the device housing 110e, for example, where it can be space limited or previously unused due to a curvature of the housing.
    [0093] [0093] Figure 14 illustrates an example of an apparatus that can be implemented with the device 110d and 110e illustrated in Figures 13A and 13B instead of using the interposer configuration, according to the aspects of the present disclosure. In Figure 14, a configuration of the sphere grid matrix (BGA) is illustrated. An RFIC 230e is illustrated as being surrounded by spheres (for example, approximately 310 micrometers thick) on a plate. A set of patch antennas (2x2 in the example illustrated in Figure 13B) can still be implemented. As illustrated,
    [0094] [0094] Figure 15 is a flow chart that illustrates a method of integrating a mold into an antenna module, according to an aspect of the present disclosure. A method 1500 starts at block 1502, in which a mold compound is deposited on a multilayer substrate including a ground plane and a multilayer antenna. For example, as shown in Figure 7, the non-metallized mold 730 and the metallized mold 732 are deposited on the multilayer substrate
    [0095] [0095] With reference again to Figure 15, in block 1506, an insulating protective material is deposited on at least one surface of the second portion of the mold compound. For example, as shown in Figure 7, insulating shield 760 is deposited on metallized mold 732, an exposed portion of conductive wall 720, a side wall of metallized mold 732, and a side wall of multilayer substrate 710. Insulating protection 760 can be composed of a conductive material, such as a pulverized conductive material (eg copper) on the surface portion of the metallized mold 732, a side wall of the metallized mold 732, and a side wall of the multilayer substrate 710. Although shown as separate steps, the formation of the conductive wall 720 and the deposit of the insulating protection 760 can be simultaneously formed using the same conductive material (for example, pulverized copper (Cu) or copper paste).
    [0096] [0096] In accordance with an additional aspect of the present disclosure, a 5G mmW antenna module or a mmW WLAN antenna module is described. This 5G mmW antenna module may include means to suppress a mold effect with loss of a mold in a portion of the antenna module. The means for suppressing can, for example, include the conductive wall 720, as shown in Figure 7. In another aspect, the means mentioned above can be any module, or any device configured to perform the functions recited by the means mentioned above.
    [0097] [0097] People skilled in the art would understand that information and signals can be represented using any of a variety of different technologies and techniques. For example, data,
    [0098] [0098] Various aspects of radio frequency (RF) communication systems have been presented with reference to various devices and methods. These devices and methods described in the detailed description below and illustrated in the accompanying drawings by various blocks, modules, components, circuits, steps, processes, algorithms, etc. (collectively referred to as “elements”). These elements can be implemented using hardware, software or combinations thereof. The implementation of such elements as hardware or software depends on the specific application and design restrictions imposed on the general system.
    [0099] [0099] For example, an element or any part of an element or any combination of elements can be implemented with a "processing system" that includes one or more processors. Examples of processors include microprocessors, microcontrollers, digital signal processors (DSPs), field programmable port arrays (FPGAs), programmable logic devices (PLDs), state machines, locked logic, discrete hardware circuits and other suitable hardware configured for perform the various features described throughout this disclosure. One or more processors in the processing system can run the software. The software should be interpreted broadly as instructions, instruction sets, code, code segments, program code, programs, subprograms, software modules, applications, software applications, software packages, firmware, routines, subroutines , objects, executables, threads of execution, procedures, functions etc., whether referred to as software / firmware, middleware, microcode, hardware description language or others.
    [0100] [0100] Consequently, one or more exemplary aspects, the functions described can be implemented in hardware, software or combinations thereof. If implemented in software, functions can be stored or encoded as one or more instructions or code on computer-readable media. Computer-readable media includes the computer's storage media. The storage media can be any available media that can be accessed by a computer. For example, and not by way of limitation, these computer-readable media may include RAM, ROM, EEPROM, PCM (phase change memory), flash memory, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other means that can be used to transport or store the desired program code in the form of instructions or data structures and that can be accessed by a computer. Floppy and disc, as used here, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disc and Blu-ray disc, where discs generally reproduce data magnetically, while discs reproduce data optically with lasers. The combinations of the items above must also be included in the scope of computer-readable media.
    [0101] [0101] In addition, the term “or” is intended to mean an inclusive “or” instead of an exclusive “or”. That is, unless otherwise specified or clear from the context, the phrase, for example, "X uses A or B" is intended to mean any of the natural inclusive permutations. That is, for example, the phrase “X uses A or B” is answered by any of the following instances: X uses A; X employs B; or X employs A and B. In addition, the articles “one” and “one”, as used in this specification and the appended claims, should generally be interpreted as meaning “one or more”, unless otherwise specified or clear from the context to be directed to a singular form. A phrase that refers to “at least one of a list of items refers to any combination of those items, including unique members. As an example ”, at least one of: a, b or c“ is intended to cover: a, b, c, a-b, a-c, b-c and a-b-c.
    [0102] [0102] The above description is provided to allow anyone skilled in the art to practice the various aspects described here. Various changes in these aspects will be readily apparent to persons skilled in the art, and the generic principles defined herein can be applied to other aspects. Thus, the claims are not intended to be limited to the aspects shown here, but must be given the full scope consistent with the language claims, where the reference to an element in the singular is not intended to mean “one and only one”, the unless specifically stated, but “one or more”. Unless otherwise indicated, the term "some" refers to one or more.
    All structural and functional equivalents to the elements of the various aspects described throughout this disclosure which are known or later known to persons skilled in the art are expressly incorporated herein by reference and must be covered by the claims.
    In addition, nothing disclosed in this document is intended to be dedicated to the public, regardless of whether such disclosure is explicitly recited in the claims.
    权利要求:
    Claims (30)
    [1]
    1. Antenna module, comprising: a ground plane on a multilayer substrate; a mold on the multilayer substrate; a conductive wall separating a first mold portion from a second mold portion and electrically coupled to the ground plane, the first portion of the mold cover a first portion of the multilayer substrate, the second portion of the mold cover a second portion of the multilayer substrate; an insulating protection on a surface of the second portion of the mold and electrically coupled to the ground plane; a first antenna included in the first portion of the multilayer substrate; and a second antenna included in the second portion of the multilayer substrate.
    [2]
    An antenna module according to claim 1, wherein a trench is formed between the conductive wall and the second mold portion.
    [3]
    An antenna module according to claim 1, wherein the insulating shield comprises a conductive material on the surface of the second mold portion, a side wall of the second mold portion and a side wall of the multilayer substrate.
    [4]
    An antenna module according to claim 3, wherein the conductive material comprises powdered copper.
    [5]
    An antenna module according to claim 1, wherein the conductive wall comprises eaves overlapping the first antenna or an integrated circuit.
    [6]
    An antenna module according to claim 5, wherein the integrated circuit comprises a radio frequency integrated circuit (RF) (RFIC) or energy management IC (PMIC).
    [7]
    An antenna module according to claim 1, wherein the conductive wall comprises a solid conductive sheet, a conductive paste, or a plurality of connected pathways.
    [8]
    8. Antenna module, according to claim 1, still comprising an integrated energy management circuit (PMIC), in which the mold is arranged to cover the PMIC.
    [9]
    9. Antenna module, according to claim 1, further comprising a radio frequency integrated circuit (RFIC), in which the mold is arranged to cover the RFIC.
    [10]
    An antenna module according to claim 1, wherein the first portion of the multilayer substrate does not include the ground plane and the second portion of the multilayer substrate includes the ground plane.
    [11]
    An antenna module according to claim 1, inclined with respect to a circuit board of a wireless device so that one or more of the first and second antennas are angled with respect to the circuit board.
    [12]
    An antenna module according to claim 11, further comprising a plurality of inclined antenna modules arranged at different edges of a user equipment (UE).
    [13]
    Antenna module according to claim 1, wherein the first antenna comprises a dipole antenna and the second antenna comprises a patch antenna.
    [14]
    An antenna module according to claim 1, comprising a set of dipole antennas included in the first portion of the multilayer substrate, and in which the conductive wall is arranged between the second portion of the mold and the first portion of the multilayer substrate.
    [15]
    Antenna module according to claim 1, coupled to a circuit board of a mobile device via a flexible connector.
    [16]
    16. Antenna module according to claim 15, wherein the flexible connector consists of power supply pins and intermediate frequency control (SE) pins.
    [17]
    17. Antenna module according to claim 16, wherein SE control pins are configured to carry control signals modulated with SE signals.
    [18]
    An antenna module according to claim 16, wherein SE control pins are configured to carry an SE signal modulated with a local oscillator (LO) signal.
    [19]
    19. Antenna module according to claim 1, further comprising an interposer that couples the multilayer substrate to a circuit board.
    [20]
    20. Antenna module according to claim 1, further comprising a sphere grid matrix that couples the multilayer substrate to a circuit board, the sphere grid matrix that involves a radio frequency integrated circuit (RFIC) and / or an antenna module power management IC (PMIC).
    [21]
    21. A method of integrating a mold into an antenna module, comprising: depositing a mold compound on a multilayer substrate including a ground plane and a multilayer antenna to form a conductive wall separating a first portion of the mold compound from a second portion of the compound mold and electrically coupled to the ground plane; depositing an insulating protective material on a surface of the second portion of the mold compound; and etching a ditch between the conductive wall and the second portion of the mold compound.
    [22]
    22. The method of claim 21, wherein depositing the mold compound comprises depositing the mold compound so that a first portion of the multilayer substrate is covered with the mold compound and a second portion of the multilayer substrate is not covered with the mold compound, wherein the first portion of the multilayer substrate includes the multilayer antenna and the second portion of the multilayer substrate includes one or more additional antennas.
    [23]
    23. The method of claim 21, further comprising attaching the antenna module to a point along a periphery of a wireless device housing.
    [24]
    24. The method of claim 21, wherein forming the conductive wall comprises depositing a conductive material on a side wall of the second portion of the mold compound including the insulating protective material.
    [25]
    25. The method of claim 21, wherein depositing the insulating protective material comprises spraying a conductive material on the surface of the second portion of the mold compound, a side wall of the mold compound, and a side wall of the multilayer substrate.
    [26]
    26. The method of claim 21, wherein depositing the mold compound comprises depositing the mold compound on a radio frequency integrated circuit (RFIC) coupled to the multilayer substrate.
    [27]
    27. Antenna module, comprising: a ground plane on a multilayer substrate; a multilayer antenna embedded in the multilayer substrate; a mold on the multilayer substrate covering at least a portion of the multilayer substrate having the multilayer antenna embedded in it; and means for suppressing a mold loss-of-mold effect on the multilayer antenna.
    [28]
    28. The antenna module according to claim 27, further comprising an insulating protection on a mold surface and electrically coupled to the ground plane.
    [29]
    29. An antenna module according to claim 27, wherein the multi-layer antenna comprises a plurality of antennas, wherein the antenna module is inclined with respect to a circuit board of a wireless device so that the plurality of antennas are angled to receive and radiate from different directions than antennas arranged on the circuit board.
    [30]
    An antenna module according to claim 29, wherein the plurality of antennas comprises patch antennas and / or dipole antennas.
    # -
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    AU2020213328B2|2019-08-05|2021-12-16|Samsung Electronics Co., Ltd.|Antenna module and electronic device for using the antenna module|
    KR102137093B1|2019-08-05|2020-07-23|삼성전기주식회사|Antenna module and electronic device including thereof|
    US10749248B1|2019-09-23|2020-08-18|Qualcomm Incorporated|Antenna module placement and housing for reduced power density exposure|
    法律状态:
    2021-11-23| B350| Update of information on the portal [chapter 15.35 patent gazette]|
    优先权:
    申请号 | 申请日 | 专利标题
    US201762566318P| true| 2017-09-30|2017-09-30|
    US62/566,318|2017-09-30|
    US201762586839P| true| 2017-11-15|2017-11-15|
    US62/586,839|2017-11-15|
    US201862688995P| true| 2018-06-22|2018-06-22|
    US62/688,995|2018-06-22|
    US16/145,100|US11245175B2|2017-09-30|2018-09-27|Antenna module configurations|
    US16/145,100|2018-09-27|
    PCT/US2018/053585|WO2019068009A1|2017-09-30|2018-09-28|Antenna module configurations|
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